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 TIP32A
Power transistor
Applications
.
Linear and swithing industrial equipment
Description
The TIP32A is a silicon Epitaxial-base PNP power transistor in Jedec TO-220 plastic package. It is intented for use in medium power linear and switching applications. The complementary NPN type is TIP31A.
1 2 3
TO-220
Internal schematic diagram
Order codes
Part number TIP32A Marking TIP32A Package TO-220 Packing Tube
November 2006
Rev 2
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www.st.com 8
Absolute maximum ratings
TIP32A
1
Absolute maximum ratings
Table 1.
Symbol VCBO VCEO VEBO IC ICM IB PTOT Tstg TJ
Absolute maximum ratings
Parameter Collector-base voltage (IE = 0) Collector-emitter voltage (IB = 0) Emitte-base voltage (IC = 0) Collector current Collector peak current (tP < 5ms) Base current Total dissipation at Tcase = 25C Tamb = 25C Storage temperature Max. operating junction temperature Value -60 -60 -5 -3 -5 -1 40 2 -65 to 150 150 Unit V V V A A A W W C C
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TIP32A
Electrical characteristics
2
Electrical characteristics
(Tcase = 25C; unless otherwise specified) Table 2.
Symbol ICEO ICES IEBO VCEO(sus
(1)
Electrical characteristics
Parameter Collector cut-off current (IB = 0) Collector cut-off current (VBE = 0) Emitter cut-off current (IC = 0) Collector-emitter sustaining voltage (IB = 0) Collector-emitter saturation voltage Test Conditions VCE =-30V VCE =-60V VEB =-5V Min. Typ. Max. -0.3 -0.2 -1 Unit mA mA mA
IC =-30mA
-60
V
VCE(sat)(1)
IC =-3A _ IC =-3A_ IC =-1A IC =-3A _
IB =-375mA V CE =-4V VCE =-4V VCE =-4V 25 10
-1.2 -1.8 50
V V
VBE(on)(1) Base-emitter voltage hFE(1) DC current gain
1. Pulsed duration = 300 ms, duty cycle 1.5%.
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Electrical characteristics
TIP32A
2.1
Typical characteristic
Figure 1. Safe operating area Figure 2. Derating Curves
Figure 3.
DC current gain
Figure 4.
Collector-emitter saturation voltage
Figure 5.
Base-emitter saturation voltage
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TIP32A
Package Mechanical Data
3
Package Mechanical Data
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
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Package Mechanical Data
TIP32A
TO-220 MECHANICAL DATA
DIM. A b b1 c D E e e1 F H1 J1 L L1 L20 L30 mm. MIN. 4.40 0.61 1.15 0.49 15.25 10 2.40 4.95 1.23 6.20 2.40 13 3.50 16.40 28.90 3.75 2.65 3.85 2.95 0.147 0.104 TYP MAX. 4.60 0.88 1.70 0.70 15.75 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 MIN. 0.173 0.024 0.045 0.019 0.60 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 0.645 1.137 0.151 0.116 inch TYP. MAX. 0.181 0.034 0.066 0.027 0.620 0.409 0.106 0.202 0.052 0.256 0.107 0.551 0.154
oP
Q
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TIP32A
Revision History
4
Table 3.
Revision History
Revision history
Revision 1 2 Initial Release The document has been reformatted Changes
Date 10-Oct-1999 15-Nov-2006
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TIP32A
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
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